Key Features

• Moderate-elasticity bristles remove abrasive particles and chemical residues after CMP with minimal friction damage
• High-density bristle arrangement increases cleaning contact points per unit area, improving efficiency while staying gentle
• Brush disc dimensions match different brands and models of post-CMP cleaning equipment chambers for precise fitting
• Consistent, stable cleaning performance batch after batch helps ensure wafer yield stability
• Diameter, hole size, bristle material (PP / nylon / PVA / abrasive) and density fully customizable

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Customization & Quality

Manufactured by Aoqun Brush (20+ years of brush-making experience, ISO-certified,
FDA/CE/RoHS tested materials). Bristle material, size, color and packaging can be
customized to your market.

OEM / ODM welcome. Free samples, delivered globally — contact us
for a quote.